Thermally Adaptive Bio-Inspired VLSI Interconnect Model for Next-Generation Embedded Systems

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This is an unedited manuscript accepted for publication and provided as an Article in Press for early access at the author’s request. The article will undergo copyediting, typesetting, and galley proof review before final publication. Please be aware that errors may be identified during production that could affect the content. All legal disclaimers of the journal apply.

Year : 2026 | Volume : 16 | 02 | Page :
    By

    Bibhu Prasad Ganthia,

  • Rosalin Pradhan,

  1. Assistant Professor, Department of Electrical Engineering, Indira Gandhi Institute of Technology, Sarang, Dhenkanal, Odisha, India
  2. Assistant Professor, Department of Electrical Engineering, Indira Gandhi Institute of Technology, Sarang, Dhenkanal, Odisha, India

Abstract

The increasing complexity of next-generation embedded systems has intensified the challenges associated with power dissipation, thermal instability, signal integrity, and interconnect reliability in Very Large- Scale Integration (VLSI) architectures. This research proposes a thermally adaptive bio-inspired VLSI interconnect model designed to enhance communication efficiency and thermal resilience in advanced embedded platforms. The proposed model integrates bio-inspired adaptive routing principles with dynamic thermal-aware interconnect management to optimize data transmission under varying operating conditions. A thermal sensing and adaptive control mechanism is incorporated to minimize hotspot formation, reduce propagation delay, and improve overall energy efficiency. The architecture employs intelligent load-balancing strategies inspired by biological neural pathways to dynamically regulate signal flow and interconnect utilization. Simulation analysis is performed using advanced VLSI design environments to evaluate parameters such as delay, power consumption, throughput, and thermal distribution. Experimental results demonstrate that the proposed approach significantly improves thermal stability, reduces energy dissipation, and enhances reliability compared with conventional interconnect architectures. The developed model offers a scalable and efficient solution for future embedded systems requiring high-speed communication, compact integration, and sustainable power-aware operation. The proposed framework can be effectively utilized in IoT devices, edge computing systems, wearable electronics, and intelligent semiconductor applications with enhanced scalability and robustness.

Keywords: VLSI Interconnects; Thermal-Aware Computing; Bio-Inspired Architecture; Embedded Systems; Energy-Efficient Integrated Circuits

How to cite this article:
Bibhu Prasad Ganthia, Rosalin Pradhan. Thermally Adaptive Bio-Inspired VLSI Interconnect Model for Next-Generation Embedded Systems. Journal of VLSI Design Tools and Technology. 2026; 16(02):-.
How to cite this URL:
Bibhu Prasad Ganthia, Rosalin Pradhan. Thermally Adaptive Bio-Inspired VLSI Interconnect Model for Next-Generation Embedded Systems. Journal of VLSI Design Tools and Technology. 2026; 16(02):-. Available from: https://journals.stmjournals.com/jovdtt/article=2026/view=245674


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Ahead of Print Subscription Review Article
Volume 16
02
Received 27/05/2026
Accepted 01/06/2026
Published 02/06/2026
Publication Time 6 Days
7

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