Total Articles : 5

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22-Aug-2026
Ahead of Print  Subscription Review Article Published on :- 22-Aug-2026

A Review on Arduino Based Distance Measurement Device

By
Rajvardhan Bagal, Sarvesh Mahimkar, Omkar Shinde, Suyash Phadke, M. M. Zade,

Abstract: Distance measurement plays a vital role in modern engineering applications such as robotics, defense systems, automotive safety, industrial automation, and assistive technologies. Traditional measuring tools such as rulers and measuring tapes are


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20-Aug-2026
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Architectural Evolution of RISC Processors: From Early Research Prototypes to Modern Industrial Implementations

By
Aditya Chauhan, Mitesh Limachia, Narendra Chauhan, Purvang Dalal,

Abstract: This paper surveys the architectural evolution of Reduced Instruction Set Computer (RISC) architectures from early research prototypes to modern industrial processors, tracing four decades of design refinement across academic, embedded, server,


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28-Jul-2026
Ahead of Print  Subscription Review Article Published on :- 28-Jul-2026

A Physics-Informed Graph Neural Network Framework for Real- Time Thermal-Aware Fault Prediction and Adaptive Power Optimization in Heterogeneous System-on-Chip Architectures

By
Bibhu Prasad Ganthia, Subash Ranjan Kabat,

Abstract: Heterogeneous System-on-Chip (SoC) architectures are increasingly adopted in edge computing, artificial intelligence, autonomous systems, and high-performance embedded platforms due to their superior computational efficiency and flexibility. However,


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25-Jun-2026
Ahead of Print  Subscription Review Article Published on :- 25-Jun-2026

Performance and Analysis of 6T, 8T & 10T SRAM Cell in 28nm Technology

By
Anagha Kamdi, Sanket B. Kasturiwala,

Abstract: Technology scaling into deep sub-micron regimes has significantly increased the design challenges of Static Random Access Memory (SRAM), particularly at the 28 nm technology node. As transistor dimensions shrink, SRAM cells become more vulnerable to


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02-Jun-2026
Ahead of Print  Subscription Review Article Published on :- 02-Jun-2026

Thermally Adaptive Bio-Inspired VLSI Interconnect Model for Next-Generation Embedded Systems

By
Bibhu Prasad Ganthia, Rosalin Pradhan,

Abstract: The increasing complexity of next-generation embedded systems has intensified the challenges associated with power dissipation, thermal instability, signal integrity, and interconnect reliability in Very Large- Scale Integration (VLSI) architectures.