STM
Journals
—
Open Access
Special Issue
Topic

Nanoelectromechanical and nanomechanics for advanced devices

Guest Editor:

        • Abstract Submission Deadline : 30/11/2023

        Manuscript Submission Deadline : 25/12/2023

        [This article belongs to Special Issue Nanoelectromechanical and nanomechanics for advanced devices under section ijemb, ijemb in (ijemb, ijemb)]

        Special Issue Description

        Nanoelectromechanics and nanomechanics are emerging fields that focus on the study and design of nanoscale devices that can convert electrical signals into mechanical motion and vice versa. These devices have unique properties, such as high sensitivity, low power consumption, and large surface-to-volume ratio, making them suitable for various applications in areas such as sensing, actuation, and communication. This special issue aims to showcase the latest research on nano electromechanics and nanomechanics for advanced devices, including experimental and theoretical studies, materials and fabrication techniques, and device integration and applications. We invite original research articles, reviews, and perspectives that highlight the most recent developments in this field.

        Editor Keywords

        Nanoelectromechanics, nanomechanics, advanced devices, electrical signals, mechanical motion, sensitivity, power consumption, surface-to-volume ratio, sensing, actuation, communication, experimental studies, theoretical studies, materials engineering, fabrication techniques, device integration, applications.

        Manuscript Submission information

        Manuscripts should be submitted online by registering and logging in to this link. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed.
        Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent on email address:[email protected] for announcement on this website.

        Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page.

        Participating journals:

        Journal Name

        International Journal of Electro-Mechanics and Material Behavior, International Journal of Electro-Mechanics and Material Behavior

        Abbrivation

        ijemb, ijemb

        ISSN

        Since

        APC

        1000  $