STM
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Open Access
Special Issue
Topic

Creep crack incubation and growth using strip yield models

Guest Editor:

        • Abstract Submission Deadline : 30/11/2023

        Manuscript Submission Deadline : 25/12/2023

        [This article belongs to Special Issue Creep crack incubation and growth using strip yield models under section ijcmm, ijcmm in (ijcmm, ijcmm)]

        Special Issue Description

        To evaluate the development and spread of creep cracks, the strip yield model developed by Dugdale, Bilby, Cottrell, and Swinden is used. This expands earlier research on growth by Heaton and Chan and Vitek (on incubation). The basic criterion for crack growth utilized is a COD-based one, following both Vitek and Heaton, and Chan. The crack is supposed to widen at a constant crack opening displacement (COD) of c and the creep strain t at the crack tip is assumed to be h, where the gauge length is a property of the material. According to the COD-based hypothesis, the net stress is in charge of controlling the incubation and failure times at very low stresses, but the stress intensity factors at big stresses. The hypothesis has the drawback of ignoring primary creep effects, which must be absorbed by adjusting the secondary creep index.

        Editor Keywords

        Strip yield model, Incubation, Growth, Criterion, Length, COD, Secondary-creep index, Crack growth

        Manuscript Submission information

        Manuscripts should be submitted online by registering and logging in to this link. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed.
        Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent on email address:[email protected] for announcement on this website.

        Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page.

        Participating journals:

        Journal Name

        International Journal of Composite Materials and Matrices, International Journal of Composite Materials and Matrices

        Abbrivation

        ijcmm, ijcmm

        ISSN

        2582-435X, 2582-435X

        Since

        2015

        APC

        950  $