Optimizing Heat Dissipation: Analysis of Air Cooled Fins for Electronic Equipments

Year : 2025 | Volume : 12 | Issue : 03 | Page : 26 50
    By

    Sharmishta Menon,

  • Naveen Solanki,

  1. Student, Department of Mechanical Engineering, Maharaja Agrasen Institute of Technology, Rohini Sec-22, Delhi, India
  2. Assistant Professor, Department of Mechanical Engineering, Maharaja Agrasen Institute of Technology,Rohini Sec-22, Delhi, India

Abstract

This paper focuses on the thermal management of electronic components in modern technologies like RADAR electronics, UAV and Drone technologies,Automotive Electronic Components etc. The main objective of this research is to design and develop an efficient heat dissipation system, using fins, for an electronic component with dimensions of 80 x 300 mm, dissipating 30W heat. The process starts by calculating essential parameters for fin design, followed by modeling the fins in SOLIDWORKS using the computed dimensions. SOLIDWORKS, a leading Computer-Aided Design (CAD) software, enables precise 3D modeling, ensuring the fins meet design specifications accurately. This approach integrates analytical calculations with advanced CAD modeling for efficient and reliable fin development. After designing, the analysis of the model is done using Ansys Fluent software student version, a leading tool in Finite Element Analysis(FEA).The paper delves into the theoretical background of fin calculation and aims to optimize fin design, maximizing heat transfer efficiency while minimizing the material wastage by reducing surface area and finding optimum fin height. The analysis results can validate the findings derived from theoretical calculations.

Keywords: Optimizing Heat Dissipation ,Air Cooled Fins ,CFD Analysis ,SOLIDWORKS, ANSYS

[This article belongs to Recent Trends in Fluid Mechanics ]

How to cite this article:
Sharmishta Menon, Naveen Solanki. Optimizing Heat Dissipation: Analysis of Air Cooled Fins for Electronic Equipments. Recent Trends in Fluid Mechanics. 2025; 12(03):26-50.
How to cite this URL:
Sharmishta Menon, Naveen Solanki. Optimizing Heat Dissipation: Analysis of Air Cooled Fins for Electronic Equipments. Recent Trends in Fluid Mechanics. 2025; 12(03):26-50. Available from: https://journals.stmjournals.com/rtfm/article=2025/view=228918


References

  1.  Han CW, Jeong SB. Evaluation of the thermal performance with different fin shapes of the air- cooled heat sink for power electronic applications. Journal of International Council on Electrical Engineering. 2016 Jan 1;6(1):17-25.
  2. Özakin AN, Kaya F. Effect on the exergy of the PVT system of fins added to an air-cooled channel: A study on temperature and air velocity with ANSYS Fluent. Solar energy. 2019 May 15;184:561- 9..
  3. Majmader FB, Hasan MJ. Thermal enhancement and entropy generation of an air-cooled 3D radiator with modified fin geometry and perforation: A numerical study. Case Studies in Thermal Engineering. 2023 Dec 1;52:103671.
  4. Lan Z, Feng YH, Liu YW. Study of rectangular fin heat sink performance and prediction based on artificial neural network. Case Studies in Thermal Engineering. 2024 Dec 1;64:105569.
  5. Shuvo MS, Mahmud MJ, Saha S. Multi-scaling analysis of turbulent boundary layers over an isothermally heated flat plate with zero pressure gradient. Heliyon. 2023 Dec 1;9(12).
  6. Raikar PP, Anand N, Pini M, De Servi C. Concurrent optimization of multiple heat transfer surfaces using adjoint-based optimization with a CAD-based parametrization. International Journal of Heat and Mass Transfer. 2025 Jan 1;236:126230.
  7. Xie L, Yuan X, Wang W. Thermal modeling of fan-cooled plate–fin heatsink considering air temperature rise for virtual prototyping of power electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2020 Jul 14;10(11):1829-39.
  8. Zhou J, Li X, Feng J, Xu X, Zhang L, Yu Y. Numerical study of non-uniform cooling heat transfer characteristics of supercritical CO2 in horizontal air-cooled finned tube. Case Studies in Thermal Engineering. 2022 Sep 1;37:102263.
  9. Zhao Z, Zhu L, Wang Y, Huang Q, Sun Y. Experimental investigation of the performance of an air type photovoltaic thermal collector system with fixed cooling fins. Energy Reports. 2023 Jun 1;9:93-100.
  10. Refai-Ahmed G, Do H, Hadad Y, Rangarajan S, Sammakia BG, Gektin V, Cader T. Establishing thermal air-cooled limit for high performance electronics devices. In2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) 2020 Dec 2 (pp. 347-354). IEEE.
  11. Gültekina E. Discharging Thermal Performance Evaluation of a Lattice-Based Battery Protection Package: An Experimental Approach.
  12. Karwa R. Heat and mass transfer. Springer Nature; 2020 Jun 18.
  13.  Incropera FP, DeWitt DP, Bergman TL, Lavine AS. Fundamentals of heat and mass transfer. New York: Wiley; 1996 Feb 16
  14. Y. A. Cengel, 2020, – “Heat transfer: A practical approach”, (6th ed.). McGraw-Hill Education.
  15. Holman JP. Heat transfer, 10th editi. ed. Mc-GrawHill Higher education. 2010.
Regular Issue Subscription Original Research
Volume 12
Issue 03
Received 13/08/2025
Accepted 23/08/2025
Published 08/10/2025
Publication Time 56 Days
155

Login


My IP

PlumX Metrics