Optimizing Heat Dissipation: Analysis of Air Cooled Fins for Electronic Equipments

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nThis is an unedited manuscript accepted for publication and provided as an Article in Press for early access at the author’s request. The article will undergo copyediting, typesetting, and galley proof review before final publication. Please be aware that errors may be identified during production that could affect the content. All legal disclaimers of the journal apply.n

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Year : 2025 [if 2224 equals=””]08/10/2025 at 2:18 PM[/if 2224] | [if 1553 equals=””] Volume : 12 [else] Volume : 12[/if 1553] | [if 424 equals=”Regular Issue”]Issue : [/if 424][if 424 equals=”Special Issue”]Special Issue[/if 424] [if 424 equals=”Conference”][/if 424] 03 | Page :

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    Sharmishta Menon, Naveen Solanki,

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  1. Student, Assistant Professor, Department of Mechanical Engineering, Maharaja Agrasen Institute of Technology, Rohini Sec-22, Department of Mechanical Engineering, Maharaja Agrasen Institute of Technology,Rohini Sec-22, Delhi, Delhi, India, India

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nThis paper focuses on the thermal management of electronic components in modern technologies like RADAR electronics, UAV and Drone technologies,Automotive Electronic Components etc. The main objective of this research is to design and develop an efficient heat dissipation system, using fins, for an electronic component with dimensions of 80 x 300 mm, dissipating 30W heat. The process starts by calculating essential parameters for fin design, followed by modeling the fins in SOLIDWORKS using the computed dimensions. SOLIDWORKS, a leading Computer-Aided Design (CAD) software, enables precise 3D modeling, ensuring the fins meet design specifications accurately. This approach integrates analytical calculations with advanced CAD modeling for efficient and reliable fin development. After designing, the analysis of the model is done using Ansys Fluent software student version, a leading tool in Finite Element Analysis(FEA).The paper delves into the theoretical background of fin calculation and aims to optimize fin design, maximizing heat transfer efficiency while minimizing the material wastage by reducing surface area and finding optimum fin height. The analysis results can validate the findings derived from theoretical calculations.nn

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Keywords: Optimizing Heat Dissipation ,Air Cooled Fins ,CFD Analysis ,SOLIDWORKS, ANSYS

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How to cite this article:
nSharmishta Menon, Naveen Solanki. [if 2584 equals=”][226 wpautop=0 striphtml=1][else]Optimizing Heat Dissipation: Analysis of Air Cooled Fins for Electronic Equipments[/if 2584]. Recent Trends in Fluid Mechanics. 08/10/2025; 12(03):-.

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nSharmishta Menon, Naveen Solanki. [if 2584 equals=”][226 striphtml=1][else]Optimizing Heat Dissipation: Analysis of Air Cooled Fins for Electronic Equipments[/if 2584]. Recent Trends in Fluid Mechanics. 08/10/2025; 12(03):-. Available from: https://journals.stmjournals.com/rtfm/article=08/10/2025/view=0

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Volume 12
[if 424 equals=”Regular Issue”]Issue[/if 424][if 424 equals=”Special Issue”]Special Issue[/if 424] [if 424 equals=”Conference”][/if 424] 03
Received 13/08/2025
Accepted 23/08/2025
Published 08/10/2025
Retracted
Publication Time 56 Days

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