Study of pH Behaviour of Slurry on Surface Morphology of Copper Material with Single Pole Magnetic Abrasive Finishing Process

Year : 2026 | Volume : 14 | Special Issue 01 | Page : 1887 1896
    By

    Pravin Kumar Singh,

  • Kheelraj Pandey,

  • Anoop Kumar Sood,

  • Ashwani Sharma,

  1. Research Scholar, Department of Mechanical Engineering, Amity University, Lucknow, Uttar Pradesh, India
  2. Assistant Professor, Department of Mechanical Engineering, Amity University, Lucknow, Uttar Pradesh, India
  3. Professor, Department of Mechanical Engineering, National Institute of Advanced Manufacturing Technology, Ranchi, Jharkhand, India
  4. Assistant Professor, Department of Mechanical Engineering, Amity University, Lucknow, Uttar Pradesh, India

Abstract

The chemical oxidizers—sodium hydroxide, Marshall’s acid salt, and hydrogen peroxide—were effectively employed in the wet polishing of copper using the SPMAF experimental setup. The manuscript explores preparation of slurry used for polishing copper material using single pole magnetic abrasive finishing (SPMAF) framework. The slurry contains distilled water, 1200-grit aluminum oxide abrasives, sodium hydroxide (NaOH), potassium persulfate (K₂S₂O₈), and hydrogen peroxide (H₂O₂), combined in precise amount. Specifically, 100 ml of distilled water, 10 g of aluminum oxide, 5 g of sodium hydroxide, 1.5 g of potassium persulfate, and 1.5 ml of hydrogen peroxide were mixed to achieve an alkaline solution with a pH of 12.26. Employing this slurry under optimal experimental conditions, the surface roughness of copper had improved from 0.0621 µm to 0.0166 µm. SEM images of raw and polished samples illustrate the effectiveness of the slurry composition in improving the surface quality with SPMAF framework The SEM image indicates that using chemical oxidizers together with the selected polishing parameters has significantly improved the surface finish of the copper workpiece, as evidenced by the absence of striation marks along the polishing direction. The chosen weight percentage of oxidizers in the alumina slurry was primarily selected to maintain a highly alkaline environment, with the pH kept between 12 and 12.5 in line with the characteristics of the oxidizing agents.

Keywords: Chemical mechanical polishing (CMP), Flexible magnetic abrasive brush (FMAB), Magnetic abrasive particles (MAPs), Material removal rate (MRR), Scanning electron microscopy (SEM).

[This article belongs to Special Issue under section in Journal of Polymer & Composites (jopc)]

How to cite this article:
Pravin Kumar Singh, Kheelraj Pandey, Anoop Kumar Sood, Ashwani Sharma. Study of pH Behaviour of Slurry on Surface Morphology of Copper Material with Single Pole Magnetic Abrasive Finishing Process. Journal of Polymer & Composites. 2026; 14(01):1887-1896.
How to cite this URL:
Pravin Kumar Singh, Kheelraj Pandey, Anoop Kumar Sood, Ashwani Sharma. Study of pH Behaviour of Slurry on Surface Morphology of Copper Material with Single Pole Magnetic Abrasive Finishing Process. Journal of Polymer & Composites. 2026; 14(01):1887-1896. Available from: https://journals.stmjournals.com/jopc/article=2026/view=239187


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Special Issue Subscription Original Research
Volume 14
Special Issue 01
Received 11/12/2025
Accepted 29/12/2025
Published 14/02/2026
Publication Time 65 Days
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