Development of Self-Healing Circuit Boards Using Shape Memory Polymer Composites

Year : 2025 | Volume : 13 | Special Issue 06 | Page : 746 770
    By

    Mohit Tiwari,

  • K. Senthil Kumar,

  • Sajith Erat,

  • Tanima Bhowmik,

  • P. Neopolean,

  • Savita Verma,

  • K.P. Yuvaraj,

  • Ram Subbiah,

  1. Assistant professor, Department of Computer Science and Engineering, Bharati Vidyapeeth’s College of Engineering, A-4, Rohtak Road, Paschim Vihar, Delhi, India
  2. Professor, Department of Agricultural Engineering, Nehru Institute of Technology, Kaliapuram, Coimbatore, Tamil Nadu, India
  3. Lecturer, University of Technology and Applied Science, Nizwa, Oman
  4. Associate Professor, Department of Computer Science Engineering (AIML), Institute of Engineering & Management, School of University of Engineering & Management, Kolkata, West Bengal, India
  5. Associate Professor, Department of Mechanical Engineering, SCAD College of Engineering and Technology, Cheranmahadevi, Tamil Nadu, India
  6. Associate Professor, Department of Chemistry, School of Engineering, Presidency University, Bengaluru, Karnataka, India
  7. Associate Professor, Department of Mechanical Engineering, Sri Krishna College of Engineering and Technology, Coimbatore, Tamil Nadu, India
  8. Professor, Department of Mechanical Engineering, Gokaraju Rangaraju Institute of Engineering and Technology, Nizampet, Hyderabad, Telangana, India

Abstract

This study investigates the influence of temperature, humidity, and nanofiller type on the electrical and structural performance of advanced polymer nanocomposites for self-healing circuit applications. Particular attention was given to conductivity retention and the morphological behavior of carbon nanotubes (CNTs), graphene, and silver nanoparticles (AgNPs). Results show that conductivity decreased under elevated thermal–humidity conditions, reflecting the role of environmental stress in material degradation. Among the tested systems, AgNP-based composites achieved the highest recovery efficiency (>95%) and demonstrated stable operation under cyclic stress. Electrical measurements revealed a temperature-dependent resistance decline, consistent with thermally activated percolative conduction. Scanning Electron Microscopy (SEM) confirmed distinct filler morphologies: fibrous CNT networks and uniformly dispersed AgNPs, both contributing to enhanced charge transport pathways. Importantly, the incorporation of these fillers improved electrical performance without compromising flexibility. These findings establish a direct link between filler dispersion, microstructural organization, and macroscopic functionality, offering valuable design guidelines for robust, long-lasting nanocomposites in flexible electronics, wearable sensors, and next-generation energy devices.

Keywords: Polymer nanocomposites, Carbon nanotubes (CNTs), Silver nanoparticles (AgNPs), Conductivity retention, Thermal stability, Morphological analysis.

[This article belongs to Special Issue under section in Journal of Polymer & Composites (jopc)]

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How to cite this article:
Mohit Tiwari, K. Senthil Kumar, Sajith Erat, Tanima Bhowmik, P. Neopolean, Savita Verma, K.P. Yuvaraj, Ram Subbiah. Development of Self-Healing Circuit Boards Using Shape Memory Polymer Composites. Journal of Polymer & Composites. 2025; 13(06):746-770.
How to cite this URL:
Mohit Tiwari, K. Senthil Kumar, Sajith Erat, Tanima Bhowmik, P. Neopolean, Savita Verma, K.P. Yuvaraj, Ram Subbiah. Development of Self-Healing Circuit Boards Using Shape Memory Polymer Composites. Journal of Polymer & Composites. 2025; 13(06):746-770. Available from: https://journals.stmjournals.com/jopc/article=2025/view=222994


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Special Issue Subscription Original Research
Volume 13
Special Issue 06
Received 10/05/2025
Accepted 22/07/2025
Published 08/08/2025
Publication Time 90 Days
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