Review And Analysis of Application of Conductive Polymer Composites in Power-Efficient RF Circuits For 5G PAPR Reduction

Year : 2025 | Volume : 13 | Issue : 03 | Page : 111-125
    By

    Tarun Mishra,

  • Vivek Upadhyaya,

  • Garima Mathur,

  1. Research Scholar, Department of Electrical and Electronics Engineering, Poornima University, Jaipur, Rajasthan, India
  2. Assistant Professor, Department of Electrical and Electronics Engineering, Poornima University, Jaipur, Rajasthan, India
  3. Professor, Department of Electronics and Communication Engineering, Poornima College of Engineering, Jaipur, Rajasthan, India

Abstract

The need for low power RF circuits has gained more importance in the background of fifth-generation (5G) wireless communication systems, since the inherent PAPR characteristic of 5G signals—especially when using orthogonal frequency division multiplexing (OFDM) based techniques—becomes high. This high PAPR limits the efficiency of RF power amplifiers, increases power consumption, and induces thermal management challenges. In this context, conductive polymer composites (CPCs), based on advanced polymer matrices integrated with functional fillers, have emerged as promising materials for next-generation RF circuits due to their flexibility, lightweight nature, intrinsic tunability, and compatibility with modern fabrication methods. This paper analytically and critically reviews recent uses of CPCs in RF circuit components including filters, antennas, interconnects, and substrates, with special emphasis on their utility in addressing the efficiency problems related to PAPR. New CPC-based approaches for EMI shielding, adaptive impedance matching, and improved amplifier linearity to counter spectral regrowth and cross-talk are also examined. Moreover, hybrid CPCs containing carbon nanotubes, graphene, and metallic fillers are compared for advanced applications like digital predistortion (DPD) and envelope tracking (ET) to mitigate PAPR in 5G base stations and user equipment. Fabrication strategies such as inkjet printing, 3D printing, and roll-to-roll processing underline the scalability and economic viability of CPC-integrated RF solutions. Finally, the paper outlines open challenges—such as high-frequency stability, long-term durability, and material standardization—and proposes future research directions and industrial applications, offering valuable insights to researchers and engineers focused on building green, high-performance RF systems for next-generation wireless communication.

Keywords: Conductive polymer composites (CPCs), dielectric permittivity, nanofiller dispersion, electromagnetic interference (EMI) shielding, thermal stability, graphene, flexible electronics, additive manufacturing, high-frequency applications, thermal management, wireless communication systems.

[This article belongs to Journal of Polymer and Composites ]

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How to cite this article:
Tarun Mishra, Vivek Upadhyaya, Garima Mathur. Review And Analysis of Application of Conductive Polymer Composites in Power-Efficient RF Circuits For 5G PAPR Reduction. Journal of Polymer and Composites. 2025; 13(03):111-125.
How to cite this URL:
Tarun Mishra, Vivek Upadhyaya, Garima Mathur. Review And Analysis of Application of Conductive Polymer Composites in Power-Efficient RF Circuits For 5G PAPR Reduction. Journal of Polymer and Composites. 2025; 13(03):111-125. Available from: https://journals.stmjournals.com/jopc/article=2025/view=209906


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Regular Issue Subscription Review Article
Volume 13
Issue 03
Received 11/04/2025
Accepted 07/05/2025
Published 15/05/2025
Publication Time 34 Days
Total Visits: 71


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