Photonic-Assisted Spintronic Solid-State Switching Model for High-Speed Memory Devices

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This is an unedited manuscript accepted for publication and provided as an Article in Press for early access at the author’s request. The article will undergo copyediting, typesetting, and galley proof review before final publication. Please be aware that errors may be identified during production that could affect the content. All legal disclaimers of the journal apply.

Year : 2026 | Volume : 04 | Issue : 01 | Page :
    By

    Bibhu Prasad Ganthia,

  • Rosalin Pradhan,

  1. Assistant Professor, Department of Electrical Engineering, Indira Gandhi Institute of Technology, Sarang, Dhenkanal, Odisha, India
  2. Assistant Professor, Department of Electrical Engineering, Indira Gandhi Institute of Technology, Sarang, Dhenkanal, Odisha, India

Abstract

The rapid advancement of high-speed computing and data-centric applications has intensified the demand for energy-efficient and ultra-fast memory technologies. This paper proposes a Photonic-Assisted Spintronic Solid-State Switching Model for next-generation high-speed memory devices. The proposed framework integrates photonic excitation mechanisms with spintronic switching dynamics to enhance data transfer speed, minimize switching delay, and reduce power dissipation in solid-state memory architectures. By combining optical pulse-assisted spin polarization with magnetic tunnel junction-based switching, the model achieves improved switching stability and enhanced thermal reliability under high-frequency operational conditions. The study employs a hybrid analytical and simulation-driven approach to evaluate switching efficiency, propagation latency, spin coherence retention, and energy consumption characteristics. Experimental modelling demonstrates that the proposed photonic-assisted architecture significantly outperforms conventional CMOS-based memory switching systems in terms of access speed, energy efficiency, and scalability. Furthermore, the integration of photonic control signals reduces electromagnetic interference and improves operational accuracy for high-density memory applications. The proposed model offers promising potential for future artificial intelligence processors, neuromorphic computing systems, quantum-inspired storage architectures, and ultra-fast embedded electronic platforms requiring reliable and low-power memory operation. For next-generation nanoelectronics memory systems operating in high-speed and energy-constrained computational environments with enhanced reliability and long-term operational stability, the suggested architecture supports scalable implementation, improves switching synchronisation, and strengthens signal integrity.

Keywords: Spintronic Memory, Photonic Switching, Solid-State Devices, High-Speed Memory, Magnetic Tunnel Junction, Energy-Efficient Computing.

[This article belongs to International Journal of Solid State Innovations & Research ]

How to cite this article:
Bibhu Prasad Ganthia, Rosalin Pradhan. Photonic-Assisted Spintronic Solid-State Switching Model for High-Speed Memory Devices. International Journal of Solid State Innovations & Research. 2026; 04(01):-.
How to cite this URL:
Bibhu Prasad Ganthia, Rosalin Pradhan. Photonic-Assisted Spintronic Solid-State Switching Model for High-Speed Memory Devices. International Journal of Solid State Innovations & Research. 2026; 04(01):-. Available from: https://journals.stmjournals.com/ijssir/article=2026/view=245335


References

  1. Benelhaouare AZ, Mellal I, Saydé M, Nicolescu G, Lakhssassi A. Thermal Side-Channel Threats in Densely Integrated Microarchitectures: A Comprehensive Review for Cyber–Physical System Security. Micromachines. 2025 Oct 11;16(10):1152.
  2. Darpan V, Baibhab C. Thermal Management Challenges in 2.5 D and 3D Chiplet Integration: A Review on Architecture–Cooling Co-Design. Eng. 2025;6(12):373.
  3. Stoikos P, Garyfallou D, Floros G, Evmorfopoulos N, Stamoulis G. Fast Electromigration Analysis via Asymmetric Krylov-Based Model Reduction. Electronics. 2025 Jul 8;14(14):2749.
  4. Sun B, Xu Z. Crosstalk analysis of delay-insensitive code in high-speed package interconnects. Micromachines. 2023 May 11;14(5):1033.
  5. Ranjan S, Jaiswal S, Latif A, Das DC, Sinha N, Hussain SS, Ustun TS. Isolated and interconnected multi-area hybrid power systems: A review on control strategies. Energies. 2021 Dec 8;14(24):8276.
  6. Mnejja S, Aydi Y, Abid M, Monteleone S, Catania V, Palesi M, Patti D. Delta multi-stage interconnection networks for scalable wireless on-chip communication. Electronics. 2020 May 30;9(6):913.
  7. Cirstea M, Benkrid K, Dinu A, Ghiriti R, Petreus D. Digital electronic system-on-chip design: Methodologies, tools, evolution, and trends. Micromachines. 2024 Feb 7;15(2):247.
  8. Cirstea M, Benkrid K, Dinu A, Ghiriti R, Petreus D. Digital electronic system-on-chip design: Methodologies, tools, evolution, and trends. Micromachines. 2024 Feb 7;15(2):247.
  9. Zhao Y, Zou L, Yu B. Physical design for advanced 3D ICs: Challenges and solutions. InProceedings of the 2025 International Symposium on Physical Design 2025 Mar 16 (pp. 209-216).
  10. Wang H, Ma J, Yang Y, Gong M, Wang Q. A review of system-in-package technologies: Application and reliability of advanced packaging. Micromachines. 2023 May 29;14(6):1149.
  11. Lu L, Zhu J, Li Y, Nagarajan A, Liu J, Shiau SY, Ai X. 3D-IC In-Design Thermal Analysis and Optimization. In2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2024 May 28 (pp. 1-5). IEEE.
  12. Pellis S. Golden Fractals in Fluid Dynamics and Turbulence. Available at SSRN 5543579. 2025 Sep 28.
  13. Dash PP, Kazerani M. Harmonic elimination in a multilevel current-source inverter-based grid- connected photovoltaic system. InIECON 2012-38th Annual Conference on IEEE Industrial Electronics Society 2012 Oct 25 (pp. 1001-1006). IEEE.
  14. Xie H, Wang Y, Gao Z, Ganthia BP, Truong CV. Research on frequency parameter detection of frequency shifted track circuit based on nonlinear algorithm. Nonlinear Engineering. 2021 Jan 1;10(1):592-9.
  15. Gu J, Wang W, Yin R, Truong CV, Ganthia BP. Complex circuit simulation and nonlinear characteristics analysis of GaN power switching device. Nonlinear Engineering. 2021 Jan 1;10(1):555- 62.

Regular Issue Subscription Review Article
Volume 04
Issue 01
Received 23/05/2026
Accepted 26/05/2026
Published 27/05/2026
Publication Time 4 Days


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