Shubham Mishra,
- Research Scholar, Department of Electrical Engineering, Jaipur Engineering College and Research Centre, Jaipur, Rajasthan, India
Abstract
The growing demand for energy-efficient systems across diverse industrial sectors, including electronics, automotive, aerospace, and renewable energy, has elevated the importance of advanced thermal management techniques. Effective heat dissipation is critical not only for maintaining optimal operating conditions in electronic devices but also for enhancing the performance and reliability of broader energy and mechanical systems. Inadequate thermal management can compromise energy efficiency, reduce component lifespan, and increase environmental impact. This review examines the principles, classifications, and comparative performance of both passive and active cooling techniques, with a focus on their applications in energy and thermal systems. Passive approaches, such as heat sinks, thermal interface materials (TIMs), phase change materials (PCMs), and heat pipes, offer sustainable and low-maintenance solutions. Active methods, including forced air convection, thermoelectric cooling, and liquid cooling, provide dynamic thermal regulation suitable for variable energy loads. Emerging innovations such as vapor chambers, nanomaterial-enhanced TIMs, and AI-driven smart cooling systems are also discussed, with an emphasis on their role in advancing the efficiency and sustainability of next-generation energy and thermal applications. The study presents a comparative analysis of cooling strategies across key performance metrics, identifies current challenges, and outlines future directions. This work aims to contribute toward the development of intelligent, energy-efficient thermal management solutions that support the evolving demands of modern energy, mechanical, and electronic systems.
Keywords: Thermal energy, sustainable cooling, mechanical systems, energy-efficient thermal management, heat transfer in energy systems
[This article belongs to International Journal of Energy and Thermal Applications ]
Shubham Mishra. Energy-Efficient Thermal Management: Advanced Cooling Techniques for Electronics, Automotive, and Aerospace Applications. International Journal of Energy and Thermal Applications. 2025; 03(01):18-23.
Shubham Mishra. Energy-Efficient Thermal Management: Advanced Cooling Techniques for Electronics, Automotive, and Aerospace Applications. International Journal of Energy and Thermal Applications. 2025; 03(01):18-23. Available from: https://journals.stmjournals.com/ijeta/article=2025/view=216793
References
- Tuckerman DB, Pease RF. High-performance heat sinking for VLSI. IEEE Electron Device Lett. 1981; 2(5): 126–129.
- Lasance C. Two decades of compact thermal modeling research: from component to system. IEEE Trans Compon Packag Technol. 2008; 31(1): 23–35.
- Ghosh S, Saha SK. Review on heat transfer analysis in microchannel heat sinks. Renew Sust Energ Rev. 2019; 91: 888–909.
- Venkatesan S, et al. Review of phase change materials for passive thermal management. Mater Today Proc. 2020; 33: 505–511.
- Ampofo F, Hassan I. Recent advances in thermal interface materials for electronics cooling: a review. Therm Sci Eng Prog. 2022; 28:
- Garimella SV. Advances in mesoscale thermal management technologies. IEEE Trans Compon Packag Technol. 2006; 29(2): 461–476.
- Raza M, et al. Nanofluids for electronics cooling—a review. Appl Therm Eng. 2015; 80: 156–167.
- Das SK, et al. Nanofluids—science and technology. John Wiley & Sons; New Jersey, USA.
- Seok J, Cho HH. Design optimization of a heat sink for CPU cooling. Appl Therm Eng. 2012; 37: 165–176.
- Ghosh S, et al. Performance analysis of mini-channel heat sink with different flow configurations. Int Commun Heat Mass Transf. 2019; 106: 1–9.
- Tan AL, et al. Thermoelectric cooling of electronic devices: a review. Front Energy. 2015; 9(1): 104–116.
- Zhang L, et al. Passive thermal management with phase change materials and enhanced heat pipes. J Electron Packag. 2021; 143(2):
- Hsieh CM, et al. Energy-efficient intelligent cooling system for data centers using fuzzy logic control. Energy Build. 2015; 86: 352–363.
- Zhang G, et al. Heat transfer enhancement in heat pipes using nanofluids. Renew Sust Energ Rev. 2018; 81: 1825–1835.
- Paul G, et al. Thermal management in electronics: a review of nanofluid applications. J Therm Anal Calorim. 2020; 139: 385–402.
| Volume | 03 |
| Issue | 01 |
| Received | 14/06/2025 |
| Accepted | 25/06/2025 |
| Published | 05/07/2025 |
| Publication Time | 21 Days |
Login
PlumX Metrics
