Ravuri Hema Krishna,
- Professor, Department of Chemistry, Amrita Sai Institute of Science and Technology, Bathinapadu, Andhra Pradesh, India
Abstract
One of the most important protocols in distributed quantum computing and quantum communication is quantum teleportation, which allows quantum information to be sent between distant nodes without actually sending the quantum particle. The teleportation process is fundamentally based on quantum entanglement, Bell state measurements, and classical communication channels, which collectively allow the accurate reconstruction of an unknown quantum state at a remote location. In recent years, rapid progress in integrated photonics and thin-film quantum materials has accelerated the development of compact, scalable, and chip-based quantum teleportation systems. Thin-film photonic platforms, including silicon photonics, silicon nitride, and thin-film lithium niobate (TFLN), have demonstrated exceptional potential due to their low optical propagation losses, high integration density, strong electro-optic properties, and compatibility with complementary metal-oxide-semiconductor (CMOS) fabrication technologies. These platforms support essential quantum functionalities such as entangled photon pair generation, integrated interferometers, quantum state manipulation, phase control, and on-chip quantum state transfer. Recent experimental demonstrations of chip-to-chip quantum teleportation, long-distance fiber-assisted teleportation, and integrated quantum logic operations further highlight the practical feasibility of thin-film photonic systems for future quantum communication networks. Moreover, advances in nanofabrication, hybrid integration, and quantum photonic circuit engineering are significantly improving teleportation fidelity, scalability, and operational stability. Despite remaining challenges associated with photon losses, decoherence, fabrication imperfections, and large-scale integration complexity, thin-film integrated photonics are expected to play a pivotal role in realizing scalable quantum networks, distributed quantum computing architectures, and the future quantum internet. This review discusses the fundamental principles of quantum teleportation, recent developments in thin-film photonic platforms, fabrication techniques, integrated quantum devices, current challenges, and prospects for scalable quantum communication technologies.
Keywords: Quantum teleportation, thin films, integrated photonics, quantum communication, entangled photons, lithium niobate, silicon photonics, quantum internet, quantum networks
[This article belongs to Journal of Thin Films, Coating Science Technology & Application ]
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Journal of Thin Films, Coating Science Technology & Application
| Volume | 13 | |
| Issue | 02 | |
| Received | 21/05/2026 | |
| Accepted | 29/05/2026 | |
| Published | 19/06/2026 | |
| Publication Time | 29 Days |