This is an unedited manuscript accepted for publication and provided as an Article in Press for early access at the author’s request. The article will undergo copyediting, typesetting, and galley proof review before final publication. Please be aware that errors may be identified during production that could affect the content. All legal disclaimers of the journal apply.
Shaikh Heena Tajoddin,
Kazi Kutubuddin Sayyad Liyakat,
- Assistant Professor, Department of Electronics and Telecommunication Engineering, BMIT, Solapur, , India
- Professor and Head, Department of Electronics and Telecommunication Engineering, BMIT, Solapur, , India
Abstract
Semiconductor materials play a fundamental role in determining the performance, efficiency, and reliability of modern electronic devices and circuits. This review presents a comprehensive analysis of how intrinsic and engineered material properties influence device behavior and overall circuit functionality. Key parameters such as bandgap energy, carrier mobility, thermal conductivity, and defect density are examined to understand their direct impact on switching speed, power consumption, and operational stability. The paper explores widely used semiconductor materials, including silicon, as well as emerging alternatives such as wide bandgap materials like silicon carbide and gallium nitride. These materials are evaluated based on their electrical and thermal characteristics, highlighting their suitability for high-frequency, high-power, and energy- efficient applications. The relationship between material properties and device-level parameters such as threshold voltage, leakage current, and breakdown voltage is discussed in detail. Furthermore, the influence of these device characteristics on circuit-level performance, including signal delay, noise margins, and power efficiency, is analyzed. The review also addresses recent advancements in material engineering, such as nanostructuring and heterojunction design, which contribute to improved device performance. Finally, current challenges related to fabrication complexity, cost, and material limitations are outlined, along with future research directions. This work provides valuable insights into the critical role of material properties in shaping next- generation semiconductor devices and circuits.
Keywords: Semiconductor Materials, Device Performance, Circuit Efficiency, Bandgap Engineering, Charge Carrier Mobility
Shaikh Heena Tajoddin, Kazi Kutubuddin Sayyad Liyakat. Impact of Semiconductor Material Properties on Device Behavior and Circuit Performance: A Comprehensive Review. Journal of Semiconductor Devices and Circuits. 2026; 13(01):-.
Shaikh Heena Tajoddin, Kazi Kutubuddin Sayyad Liyakat. Impact of Semiconductor Material Properties on Device Behavior and Circuit Performance: A Comprehensive Review. Journal of Semiconductor Devices and Circuits. 2026; 13(01):-. Available from: https://journals.stmjournals.com/josdc/article=2026/view=242458
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Journal of Semiconductor Devices and Circuits
| Volume | 13 |
| 01 | |
| Received | 29/04/2026 |
| Accepted | 30/04/2026 |
| Published | 01/05/2026 |
| Publication Time | 2 Days |
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