International Journal of Electro-Mechanics and Material Behavior Cover

International Journal of Electro-Mechanics and Material Behavior

Editors Overview

ijemb maintains an Editorial Board of practicing researchers from around the world, to ensure manuscripts are handled by editors who are experts in the field of study.

Open Access
Special Issue
Topic

Mechanics and electromechanics of soft materials

Abstract Submission Deadline : November 30, 2024

Manuscript Submission Deadline : December 25, 2024

Special Issue Description

Soft materials, such as polymers, gels, and biological tissues, exhibit unique mechanical and electromechanical properties that make them ideal for a wide range of applications, from soft robotics and wearable devices to biomedical implants and sensors. Understanding the mechanics and electromechanics of these materials is crucial for the design and optimization of such applications. This special issue aims to bring together the latest research on the mechanics and electromechanics of soft materials, including experimental, theoretical, and computational studies. We invite original research articles, reviews, and perspectives that shed light on the fundamental principles governing the mechanical and electromechanical behavior of soft materials, as well as their applications in various fields.

Keywords

Soft materials, mechanics, electromechanics, polymers, gels, biological tissues, soft robotics, wearable devices, biomedical implants, sensors.

Manuscript Submission information

Manuscripts should be submitted online via the manuscript Engine. Once you register on APID, click here to go to the submission form. Manuscripts can be submitted until the deadline.
All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the email address:[email protected] for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a Double-blind peer-review process. A guide for authors and other relevant information for the submission of manuscripts is available on the Instructions for Authors page.

Participating journals:



Journal Name

International Journal of Electro-Mechanics and Material Behavior

Abbrivation


ijemb

ISSN


Since

2023

APC

1000  $