Trends in Mechanical Engineering & Technology Cover

Trends in Mechanical Engineering & Technology

ISSN: 2231-1793

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Open Access
Special Issue
Topic

Simulated annealing algorithm

Abstract Submission Deadline : November 30, 2024

Manuscript Submission Deadline : December 25, 2024

Special Issue Description

The simulated annealing algorithm is an optimization method that mimics the slow cooling of metals, which is characterized by a progressive reduction in the atomic movements that reduce the density of lattice defects until a lowest-energy state is reached [143]. Similarly, at each virtual annealing temperature, the simulated annealing algorithm generates a new potential solution (or neighbor of the current state) to the problem considered by altering the current state, according to a predefined criterion. The acceptance of the new state is then based on the satisfaction of the Metropolis criterion, and this procedure is iterated until convergence. The simulated annealing algorithm performs the following steps: The algorithm generates a random trial point. The algorithm chooses the distance of the trial point from the current point by a probability distribution with a scale depending on the current temperature.

Keywords

Manuscript Submission information

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All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the email address:[email protected] for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a Double-blind peer-review process. A guide for authors and other relevant information for the submission of manuscripts is available on the Instructions for Authors page.

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