Integrated Analysis of Stress Patterns in Transparent Polycarbonate Specimens: A Comparative Study between Photoelasticity and FEA Simulation for Compact Circular Testing

Open Access

Year : 2024 | Volume : | : | Page : –
By

Om Prakash Sondhiya

Roopesh Tiwari

  1. Assistant Professor Department of Mechanical Engineering, Institute of Engineering &Technology, DAVV, Indore Madhya Pradesh India
  2. HOD 2Department of Mechanical Engineering, SAGE University, Indore, Madhya Pradesh India

Abstract

Photoelasticity stands as a robust experimental technique within the realms of mechanics and materials science, offering a means to visually assess and analyze stress distribution within materials possessing transparency or translucency. This method, a non-destructive testing approach, involves the visualization of stress on a model subjected to a load, leveraging the unique property of materials known as birefringence or double refraction. The procedure entails the careful selection of a suitable photoelastic material exhibiting birefringence, the creation of a physical model replicating real-world structures, and the application of mechanical stress to the model. Under the influence of stress, the material experiences birefringence, inducing alterations in its optical properties. The resulting pattern reflects various stress levels, facilitating the identification of stress concentrations, potential failure points, and providing insights into material behavior under different conditions. In present research work, The compact circular specimen underwent testing using a photoelasticity unit, subjected to four distinct loads. The outcomes from this experimental analysis were then compared with the results obtained through ANSYS simulation

Keywords: Polarization, Photo elasticity, Polari scope, Stress, Isochromatic and isoclinic fringes.

How to cite this article: Om Prakash Sondhiya, Roopesh Tiwari. Integrated Analysis of Stress Patterns in Transparent Polycarbonate Specimens: A Comparative Study between Photoelasticity and FEA Simulation for Compact Circular Testing. Journal of Polymer and Composites. 2024; ():-.
How to cite this URL: Om Prakash Sondhiya, Roopesh Tiwari. Integrated Analysis of Stress Patterns in Transparent Polycarbonate Specimens: A Comparative Study between Photoelasticity and FEA Simulation for Compact Circular Testing. Journal of Polymer and Composites. 2024; ():-. Available from: https://journals.stmjournals.com/jopc/article=2024/view=145528

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Ahead of Print Open Access Original Research
Volume
Received January 9, 2024
Accepted April 20, 2024
Published May 8, 2024