An Approach on Optimization of Thermo Physical Properties of Teak Wood Dust Filled Polymeric Composites

Open Access

Year : 2021 | Volume : | Issue : 3 | Page : 67-80
By

    Ramesh Chandra Mohapatra

  1. Associate Professor, Mechanical Department, Government College of Engineering, Odisha, India

Abstract

The aim of the present work was to prepare the specimens with the help of hand-lay-up technique to measure the thermal properties of TWDPC. The density & voids of TWDPC were measured to determine its physical property & significantly affected some of its mechanical properties. Taguchi experimental method was applied to optimize its thermal properties. The optimal factor combinations were determined with the help of ANOM & the analysis of variance (ANOVA) identified the level of importance on the parameters on each of the thermal properties. ANOM results showed that the contribution parameters for minimum value of thermal conductivity, linear thermal expansion & maximum value of specific heat capacity were B>C >A, A>C>B & C>A>B. From ANOVA results it was found that the volume fraction & the particle size of TWD has major influence for minimizing the thermal conductivity & linear thermal expansion, whereas the polymer resin was one of the best parameters to maximize the specific heat of TWDPC. Finally, it was concluded that TWDPC was one of the eco-friendly composites which can be used for various thermal applications

Keywords: Teak wood dust, Polymer resin, Thermal properties, Taguchi technique, ANOM, ANOVA.

[This article belongs to Journal of Polymer and Composites(jopc)]

How to cite this article: Ramesh Chandra Mohapatra An Approach on Optimization of Thermo Physical Properties of Teak Wood Dust Filled Polymeric Composites jopc 2021; 9:67-80
How to cite this URL: Ramesh Chandra Mohapatra An Approach on Optimization of Thermo Physical Properties of Teak Wood Dust Filled Polymeric Composites jopc 2021 {cited 2021 Dec 08};9:67-80. Available from: https://journals.stmjournals.com/jopc/article=2021/view=90135

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Regular Issue Open Access Article
Volume 9
Issue 3
Received May 30, 2021
Accepted November 8, 2021
Published December 8, 2021