Open Access
Manoj Tripathi
- Assistant Professor, Department of Physics and Materials Science and Engineering,, Jaypee Institute of Information Technology, Uttar Pradesh, India
Abstract
Polymer composite materials attract researchers as polymers can be filled with different fillers to get desired properties. Thermophysical properties of HDPE-silicon composite is reported in the present study. HDPE-Si composite was synthesized by hot compression and molding technique for different silicon volumetric ratio. Thermal conductivity as well as thermal diffusivity was found to be enhanced significantly on increasing the filler volumetric ratio. Thermal conductivity value for 20 volume % composite was more than twice of the pure HDPE (0.364 W/m-K for pure HDPE and 0.733 W/m-K for 20 volume % composite). Thermal diffusivity value of 20 volume % composite (0.518 mm2/s) was also more than double than that of the pure HDPE (0.224 mm2/s). TGA analysis of composite showed a substantial increase in thermal stability from 414°C (for pure HDPE) to 454°C (for 20 volume % silicon). Thermophysical properties were also measured at elevated temperature from 30°C to 80°C for different volumetric ratio of filler. Both thermal conductivity and thermal diffusivity showed a gradual decrement on increasing the temperature. Adding more silicon to the HDPE caused a better adhesion between HDPE and silicon which improved the hardness of the synthesized composite.
Keywords: Compression moulding, Hardness, Polymer composite, Thermal conductivity, Thermal stability
This article belongs to Special Issue Conference ICASEMCT-2023: International Conference on Advancements in Smart Electronics, Materials and Communication Technologies
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Journal of Polymer and Composites
| Volume | 11 |
| Special Issue | 05 |
| Received | May 5, 2023 |
| Accepted | July 6, 2023 |
| Published | August 25, 2023 |