Total Articles : 2
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Review Article
02-Jun-2026
Thermally Adaptive Bio-Inspired VLSI Interconnect Model for Next-Generation Embedded Systems
By
Bibhu Prasad Ganthia, Rosalin Pradhan,
Abstract: The increasing complexity of next-generation embedded systems has intensified the challenges associated with power dissipation, thermal instability, signal integrity, and interconnect reliability in Very Large- Scale Integration (VLSI) architectures. …
[This section belongs to Journal of VLSI Design Tools and Technology ]
Ahead of Print
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Review Article
02-Apr-2026
DESIGN & IMPLEMENTATION OF16-BIT MAC UNIT USING VEDIC MATHEMATICS
By
K. Durga Devi, B. Hema Shankar, A. Phani Kumar, J. Vivek, Dr. T. Saran Kumar, Dr. Akula pravin,
Abstract: Multiply and Accumulate (MAC) units are essential parts of digital systems, particularly in embedded systems, digital signal processing (DSP), and image processing. The performance of these systems is significantly impacted by how well the …
[This section belongs to Journal of VLSI Design Tools and Technology ]