International Journal of Microelectronics and Digital Integrated Circuits

International Journal of Microelectronics and Digital Integrated Circuits International Journal of Microelectronics and Digital Integrated Circuits [2456-3986(e)] is a peer-reviewed hybrid open-access journal launched in 2015  that publishes original research concerning microelectronics and digital integrated circuits and including analog circuits, digital circuits, embedded systems, and MOSFET transistors. Journal intensively promotes the application and experimental research and urges to make an impact on the research published.

• Microelectronic Devices and Technologies: Semiconductor devices, MOSFETs, CMOS devices, BJTs, FinFETs, gate-all-around transistors, tunnel FETs, nanoscale devices, device modelling, fabrication technologies, scaling effects, and emerging semiconductor structures.
• Digital Integrated Circuit Design: Combinational and sequential circuits, arithmetic circuits, logic families, finite-state machines, digital architectures, low-power digital design, clocking techniques, timing optimization, and high-speed digital circuits.
• Analog Integrated Circuits: Operational amplifiers, comparators, voltage and current references, regulators, oscillators, active filters, amplifiers, analog signal-conditioning circuits, current mirrors, and analog interface circuits.
• Mixed-Signal Integrated Circuits: Analog-to-digital converters, digital-to-analog converters, phase-locked loops, data converters, mixed-signal interfaces, clock and data recovery, mixed-signal modelling, and mixed-signal verification.
• RF and Microwave Integrated Circuits: RF amplifiers, low-noise amplifiers, mixers, oscillators, frequency synthesizers, RF front ends, wireless transceivers, microwave integrated circuits, millimeter-wave circuits, and RF CMOS technologies.
• VLSI Design and Architecture: VLSI architectures, processor design, application-specific integrated circuits, system-level design, low-power architectures, high-performance circuits, multicore architectures, and reconfigurable systems.
• Electronic Design Automation: Circuit simulation, logic synthesis, placement and routing, static timing analysis, physical verification, layout automation, power analysis, design optimization, and computer-aided integrated circuit design.
• Hardware Description Languages and RTL Design: VHDL, Verilog, SystemVerilog, RTL modelling, behavioral modelling, register-transfer design, synthesizable coding, hardware abstraction, and digital design methodologies.
• High-Level Synthesis and Hardware Design Automation: C/C++/SystemC-based hardware design, high-level synthesis, design-space exploration, hardware/software partitioning, automated RTL generation, and system-level optimization.
• Functional and Formal Verification: Functional verification, formal verification, assertion-based verification, equivalence checking, static analysis, coverage-driven verification, RTL linting, simulation-based verification, and verification methodologies.
• Testing and Design for Testability: Fault modelling, automatic test-pattern generation, scan design, boundary scan, built-in self-test, memory testing, fault diagnosis, test compression, reliability testing, and DFT architectures.
• Embedded Systems: Embedded processors, microcontrollers, embedded hardware, real-time systems, firmware-hardware integration, embedded sensing, control systems, embedded communication, and application-specific embedded platforms.
• System-on-Chip and Network-on-Chip: SoC architecture, MPSoCs, hardware accelerators, on-chip interconnects, bus architectures, Network-on-Chip, heterogeneous SoCs, IP integration, and system-level integration.
• Memory Devices and Architectures: SRAM, DRAM, flash memory, non-volatile memory, RRAM, MRAM, FRAM, phase-change memory, emerging memory technologies, cache architectures, and memory controllers.
• Low-Power and Energy-Efficient Circuits: Power gating, clock gating, voltage scaling, leakage reduction, ultra-low-power circuits, energy-efficient architectures, power-aware design, and energy harvesting interfaces.
• Emerging Semiconductor Devices: FinFETs, nanosheet transistors, tunnel FETs, memristors, spintronic devices, ferroelectric devices, quantum devices, 2D materials, carbon-based electronics, and beyond-CMOS technologies.
• Photonics and Optoelectronic Integrated Circuits: Optical interconnects, semiconductor lasers, photodetectors, optical receivers, photonic integrated circuits, optical modulators, waveguides, and optoelectronic devices.
• MEMS and Microsystems: Microelectromechanical systems, microsensors, microactuators, integrated microsystems, sensor interfaces, MEMS-based electronics, and heterogeneous microsystem integration.
• Signal Processing Circuits: Analog and digital signal-processing circuits, filters, DSP architectures, image-processing circuits, audio-processing circuits, communication signal processing, and real-time signal-processing hardware.
• Communication Integrated Circuits: Wireless communication circuits, transmitters, receivers, modulation and demodulation circuits, baseband processors, communication interfaces, RF transceivers, and digital communication hardware.
• Audio and Multimedia Integrated Circuits: Audio amplifiers, class-D amplifiers, audio processors, codecs, multimedia signal-processing circuits, display electronics, and low-power multimedia hardware.
• Power Management Integrated Circuits: Linear regulators, switching regulators, DC-DC converters, low-dropout regulators, battery-management ICs, power-management units, voltage references, and integrated power-control circuits.
• Hardware Security and Trusted Electronics: Hardware Trojans, side-channel attacks, physically unclonable functions, secure integrated circuits, cryptographic hardware, trusted computing, tamper-resistant design, and secure hardware architectures.
• Artificial Intelligence Hardware: AI accelerators, neural-processing units, neuromorphic circuits, machine-learning hardware, edge-AI processors, in-memory computing, hardware-efficient neural networks, and AI-assisted chip design.
• Advanced Packaging and Heterogeneous Integration: 2.5D and 3D ICs, chiplets, through-silicon vias, system-in-package, heterogeneous integration, thermal management, die stacking, and advanced semiconductor packaging.
• Reliability and Variability in Integrated Circuits: Process variation, aging, thermal effects, soft errors, radiation effects, electromigration, reliability modelling, fault tolerance, yield analysis, and lifetime prediction.
• Emerging Microelectronics Technologies: Flexible electronics, printed electronics, wearable electronics, bioelectronics, IoT hardware, autonomous electronic systems, digital twins for IC design, and next-generation microelectronic technologies.