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Special Issue Topics

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Open Access

Special Issue

Topic

Biomechanics and bio electromechanics for medical applications

Guest Editor:

Abstract Submission Deadline : 30/11/2023

Manuscript Submission Deadline : 25/12/2023

[This article belongs to Special Issue Biomechanics and bio electromechanics for medical applications under section ijemb, ijemb in (ijemb, ijemb)]

Special Issue Description

Biomechanics and bio electromechanics are interdisciplinary fields that investigate the mechanical and electrical properties of biological systems, from cells and tissues to organs and organisms. These fields have significant implications for medical applications, including diagnosis, treatment, and rehabilitation of various diseases and injuries. This special issue aims to showcase the latest research on biomechanics and bio electromechanics for medical applications, including computational modeling, experimental characterization, and clinical translation. We invite original research articles, reviews, and perspectives that highlight the most recent developments in this field.

Editor Keywords

Biomechanics, bio electromechanics, medical applications, computational modeling, experimental characterization, clinical translation, cells, tissues, organs, diagnosis, treatment, rehabilitation, diseases, injuries.

Manuscript Submission information

Manuscripts should be submitted online by registering and logging in to this link. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed.
Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent on email address:[email protected] for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page.

Participating journals:

Journal Name

International Journal of Electro-Mechanics and Material Behavior, International Journal of Electro-Mechanics and Material Behavior

Abbrivation

ijemb, ijemb

ISSN

Since

2023

APC

1000 $

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