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Open Access
Special Issue
Topic

Multifunctional materials for electromechanical applications

Guest Editor:

Abstract Submission Deadline : 30/11/2023

Manuscript Submission Deadline : 25/12/2023

[This article belongs to Special Issue Multifunctional materials for electromechanical applications under section ijemb, ijemb in (ijemb, ijemb)]

Special Issue Description

Multifunctional materials are a class of materials that exhibit multiple functionalities, such as mechanical, electrical, thermal, and optical properties, in a single material system. These materials have attracted significant attention in recent years due to their potential to revolutionize various fields, including electronics, energy, and healthcare. In particular, the integration of multiple functionalities in a single material system can lead to the development of advanced electromechanical devices with enhanced performance and functionality. This special issue aims to showcase the latest research on multifunctional materials for electromechanical applications, including design, fabrication, characterization, and applications. We invite original research articles, reviews, and perspectives that highlight the most recent developments in this field.

Editor Keywords

Multifunctional materials, electromechanical applications, mechanical properties, electrical properties, thermal properties, optical properties, electronics, energy, healthcare, design, fabrication, characterization.

Manuscript Submission information

Manuscripts should be submitted online by registering and logging in to this link. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed.
Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent on email address:[email protected] for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page.

Participating journals:

Journal Name

International Journal of Electro-Mechanics and Material Behavior, International Journal of Electro-Mechanics and Material Behavior

Abbrivation

ijemb, ijemb

ISSN

Since

2023

APC

1000  $