Open Access
Special Issue
Topic

Emerging trends in electroactive polymers for actuation and sensing

Guest Editor:

Abstract Submission Deadline : 30/11/2023

Manuscript Submission Deadline : 25/12/2023

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Special Issue Description

Electroactive polymers (EAPs) are a class of materials that can undergo large deformations in response to an electric field. They have attracted significant attention in recent years due to their unique electromechanical properties, which make them ideal for actuation and sensing applications in various fields, including robotics, aerospace, healthcare, and energy. This special issue aims to highlight the latest research on emerging trends in EAPs for actuation and sensing, including new materials, fabrication techniques, and applications. We invite original research articles, reviews, and perspectives that showcase the most recent developments in this field.

Editor Keywords

Electroactive polymers, actuation, sensing, robotics, aerospace, healthcare, energy, new materials, fabrication techniques, applications.

Manuscript Submission information

Manuscripts should be submitted online by registering and logging in to this link. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed.
Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent on email address:[email protected] for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page.

Participating journals: