International Journal of Electro-Mechanics and Material Behavior

Editors Overview

ijemb maintains an Editorial Board of practicing researchers from around the world, to ensure manuscripts are handled by editors who are experts in the field of study.

Open Access
Special Issue
Topic

Multifunctional materials for electromechanical applications

Abstract Submission Deadline : November 30, 2023

Manuscript Submission Deadline : December 25, 2023

Special Issue Description

Multifunctional materials are a class of materials that exhibit multiple functionalities, such as mechanical, electrical, thermal, and optical properties, in a single material system. These materials have attracted significant attention in recent years due to their potential to revolutionize various fields, including electronics, energy, and healthcare. In particular, the integration of multiple functionalities in a single material system can lead to the development of advanced electromechanical devices with enhanced performance and functionality. This special issue aims to showcase the latest research on multifunctional materials for electromechanical applications, including design, fabrication, characterization, and applications. We invite original research articles, reviews, and perspectives that highlight the most recent developments in this field.

Keywords

Multifunctional materials, electromechanical applications, mechanical properties, electrical properties, thermal properties, optical properties, electronics, energy, healthcare, design, fabrication, characterization.

Manuscript Submission information

Manuscripts should be submitted online via the manuscript Engine. Once you register on APID, click here to go to the submission form. Manuscripts can be submitted until the deadline.
All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the email address:[email protected] for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a Double-blind peer-review process. A guide for authors and other relevant information for the submission of manuscripts is available on the Instructions for Authors page.

Participating journals: